Breakaway & Pogo Pin
ITT’s series of breakaway harsh environment connectors is a small rugged interconnect family utilizing a spring probe contact system. Designed and manufactured to meet the most demanding electrical and mechanical performance requirements this next generation interconnect family consists of circular and rectangular versions. The number of contacts in the circular designs goes to 48 positions. Rectangular designs can accommodate up to 137 positions depending on signal transmission requirements. Both the circular and rectangular versions utilize quick disconnect coupling mechanisms. Other coupling mechanisms such as bayonet or blind mate options are available.
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Innovative PCB Interface Connector
The MBF connector represents an innovative design engineered to meet the critical needs of space systems and high-end avionics applications. Designed using robust materials and a unique, side-by-side contact arrangement, the MBF excels by providing an extremely small and lightweight solution for PCB applications. Designed to provide single or multilayer configuration support, the MBF incorporates specifically designed features to ensure ease in alignment and assembly, excelling over prior, elastomer based solutions. The innovative MBF design represents a unique approach to solving weight and size constraints in multiple high-end electronic applications which require multiple PCB’s.
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Miniature ZIF Connector for Optimized Data
ITT Interconnect Solutions has developed the QLC Series connector to meet the requirements of portable medical equipment. The QLC connector is a miniature addition to ITT’s proven Zero Insertion Force (ZIF) DL Family (DL, DLM and DLP Series) of connectors. With technology advances for small portable imaging equipment, the demand for a smaller, higher pin count, shielded, reliable connector proves essential. Consequently, ITT reduced the spacing from the standard DL to 0.8mm, thus reducing the overall size by more than 60% with the same (260) number of contacts.
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PHD High Density Fiber Optic Interconnect Technology
The PHD terminus system provides the industry’s highest and most stable performance for multi-channel interconnects. PHD delivers reduced insertion loss, less channel to channel variance, easy integration into High Density interconnect hardware, and maintainability features found in simplex interconnects.
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Stacking Interconnect Technology
ITT’s Stacking Interconnect allows for maximum expandability in applications requiring Power, LF, and RF signals. Expandability is achieved by “stacking” the over-molded right angle assemblies. A Nitrile Butadiene Rubber gasket can be added to the interface providing various degree’s of sealing. Top and bottom caps are fitted to protect against dust and moisture to the finished unit. A special locking mechanism gives the installer a visual and audible confirmation.
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