Our NDD M32139-style Nano-D is a small form factor, high density interconnect designed and manufactured for high reliability and harsh environment applications. These interconnects are ideal when size and weight limitations require an ultra low profile and robust design package. Utilizing our innovative twist pin contact system on 0.025 contact spacing and 5 points of electrical contact, the NDD series offers an extremely rugged small form factor interconnect solution. Typical applications include military avionics, oil & gas industry exploration and missile systems.
Our facility is not currently certified by the DLA and this product is not covered by the QPL/QML.