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Micro MDM / MDLM - 200°C High-Temperature
Cannon’s F222 High Temp Micro – MDM / MLDM Series offers exceptional reliability and performance in a lightweight, space-saving design. Its design is based on MIL-DTL-83513 specifications, but qualification tested to withstand 200ºC continuous operating temperature to service a wide range of applications include launch systems, smart weapons system to downhole drilling. The High Temp Micros supports current ratings up to 3A, 500 mating cycles and comes in a wide range of configurations include standard or low-profile stranded wire, solid wire, solder pot and board mount (PCB).
- Designed to MIL-DTL-83513 specifications
- Standard or low profile, cable-to-cable and board mount configurations
- Micro Twist Pin recessed into plug insulators
- Current rating: 3A
- Durability: 500 mating cycles
- Contacts: copper alloy; gold plated
- Operating temperature: -55°C to +200°C
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Ultra-High Temp Micro-MDM Sell Sheet
High Temp Micro MDM Brochure
|Shell Plating||Electroless nickel or Yellow chromate /cadmium over nickel (At temperatures above 175°C, yellow chromate over cadmium can cause shell discoloration and deterioration of the chromate conversion coating)|
|Insulator||Liquid crystal polymer per MIL-M-24519, type GLCP-30F|
|Shell Style||Plug and receptacle|
|Durability||500 mating cycles|
|Contact Style / Termination||Stranded wire, Solid wire, Solder pots, PCB|
|Operation Temperature||-55º C to 200º C|
|Dielectric with Standing Voltage||600VAC at sea level, 150 VAC at 70,000’ altitude|
|Number of Signal Contacts (MIN/MAX)||
9, 15, 21, 25, 31, 37, 51, 69*, 100
*MDM Wired & Solder Pot
|Gauge Wire Size||Stranded wire: 24 AWG thru 32 AWG / Solid wire: 25 AWG / Solder pots: 26 AWG or smaller / PC tails: 24 AWG|