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MOVE-MOD™ Series - Ultimate in modularity and flexibility by utilizing a range of snap in modules.
Harsh Environment Connector Plating - Blog
Highly engineered RoHS & REACH compliant plating.
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HDx Series
High-Density, Small Form Factor Interconnect with Watertight Sealing up to 20 Meters
ITT Cannon’s HDxTM Series offers a reliable, small form factor (SFF) solution in a lightweight, compact design. With breakaway or screw-lock breakaway coupling options, this high-density interconnect enables critical USB, HDMI or Ethernet high-speed data transmission.
Cannon’s HDx Series comes in an anti-glare, non-reflective Ruthenium plating and is rated up to 20-meter sealing depth when mated. This combined with its high durability rating, provides end users with a dependable interconnect system in any mission critical situation.
- Lightweight, compact design
- Ultra-high density layouts
- Signal & power configurations
- Support high speed data - USB® 3.1 Gen1 up to 5Gbit/s, Ethernet up to 10Gbit/s, HDMI® up to 8.16 Gbit/s
- Watertight sealing up to 20 meter depth
- High-durability with 5,000 mating cycles
- Anti-glare, non-reflective plating
- Break-away or Threaded Locking Options
HDx Series
HDx Series- High Density Small Form Factor Sell Sheet
ITT Cannon Soldier-Worn Solutions Guide
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