MOVE-MOD™ Series - Ultimate in modularity and flexibility by utilizing a range of snap in modules.
Ruggedized, high-density I/O solutions from Space Grade to Combo D & Double Density
Originally designed & patented by Cannon engineers for use on commercial & military aviation systems, today we offer an array of D-Sub styles, sizes, configurations, and accessories. From rocket launchers and satellite systems, to flight simulators, portable medical equipment and industrial machinery, its performance, reliability and versatility have made this Cannon invention one of the most widely used connectors in the world.
- Standard, High Density, Double Density & Combo-D Layouts
- Crimp, Solder Cup, PCB & Wire Wrap Terminations
- Wide-range of Shell Materials & Plating Options including RoHS
- Accessory Backshells w/Locking Hardware, Guide Plates & Polarization Options
- Select Parts Qualified to NASA & SAE Standards