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HDx Series- High-Density, Small Form Factor
ITT Cannon’s HDxTM Series offers a reliable, small form factor (SFF) solution in a lightweight, compact design. With breakaway or screw-lock breakaway coupling options, this high-density interconnect enables critical USB, HDMI or Ethernet high-speed data transmission.
Cannon’s HDx Series comes in an anti-glare, non-reflective Ruthenium plating and is rated up to 20-meter sealing depth when mated. This combined with its high durability rating, provides end users with a dependable interconnect system in any mission critical situation.
Features
- Lightweight, compact design
- Ultra-high density layouts
- Signal & power configurations
- Support high speed data - USB® 3.1 Gen1 up to 5Gbit/s, Ethernet up to 10Gbit/s, HDMI® up to 8.16 Gbit/s
- Watertight sealing up to 20 meter depth
- High-durability with 5,000 mating cycles
- Anti-glare, non-reflective plating
- Break-away or Threaded Locking Options
HDx Series- High-Density, Small Form Factor
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Resources
HDx Series
HDx Series- High Density Small Form Factor Sell Sheet
ITT Cannon Soldier-Worn Solutions Guide
Product Specification
Environmental
| Sealing | High Pressure Sealing 20+ Meters |
| Operation Temperature | -51°C to +125°C |
Mechanical
| Shell Style | Circular - In-line and Rear Panel Mount |
| Durability | 5000 mating cycles @ ambient temperature |
| Power & Signal In Same Layout | Contact Factory for Application Requirements |
| Contact Style / Termination | Printed Circuit, Solder Cup |
Material
| Shell | Brass |
| Insulator | Ruthenium over Electroless Nickel Plating |
| Contact | Copper Alloy |
| Contact Plating | Gold over Nickel Plating |
Electrical
| Operating Voltage | 250 VDC |
| Current Rating | Ø0.3mm Contacts: 1 Amp Max (Single Contact) Ø0.7mm Contacts: 5 Amps (Single Contact) |
| Number of Signal Contacts (Min/Max) | 9, 12, 16 - Consult Factory for Additional Configurations |
| Gauge Wire Size | #22 - #28 AWG, Layout dependent: Ø0.3mm Solder Contacts: 28 AWG and Ø0.7mm Solder Contacts: 22 AWG |
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